XC7S100-2FGGA676I Manufacturers

XCVU3P-2FFVC1517I is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.

MAX1363EUB+ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

IMX317CQC-C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

FPC,Flexible Printed Circuit, or FPC for short, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.

10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

​MT41K128M16JT-125AIT:K is a type of synchronous dynamic random-access memory (SDRAM) module. It is primarily designed for use in various high-performance computing applications and offers a capacity of 2 gigabytes.