XC7K325T-2FFG676I Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Customer need is our God for XC7K325T-2FFG676I, With our rules of " organization track record, partner trust and mutual benefit", welcome all of you to function together , improve jointly.
XC7K325T-2FFG676I, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Hot Products

  • PC28F00AP30TF

    PC28F00AP30TF

    PC28F00AP30TF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-3CSG484C

    XC6SLX45-3CSG484C

    XC6SLX45-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX290NF45C3N

    EP4SGX290NF45C3N

    EP4SGX290NF45C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 6 layers ELIC HDI PCB

    6 layers ELIC HDI PCB

    Any Layer Inner Via Hole,The arbitrary interconnection between layers can meet the wiring connection requirements of high-density HDI boards. Through the setting of thermally conductive silicone sheets, the circuit board has good heat dissipation and shock resistance.The following is about 6 layers ELIC HDI PCB, I hope to help you better understand 6 layers ELIC HDI PCB.
  • LTC6804IG-1#TRPBF

    LTC6804IG-1#TRPBF

    LTC6804IG-1#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K70T-2FBG676C

    XC7K70T-2FBG676C

    XC7K70T-2FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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