XC6VLX75T-3FFG484C Manufacturers

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Hot Products

TCME687M006R0012
TCME687M006R0012 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
PCM5102AQPWRQ1
PCM5102AQPWRQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EP2AGX95EF35C5N
EP2AGX95EF35C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EP2S60F672I4N
EP2S60F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
MAX3362EKA+T
MAX3362EKA+T is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
MT41K1G8SN-125:A
MT41K1G8SN-125:A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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What is the future development prospect of chips in China
Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.
What is a high-speed PCB design?
‌High-speed PCB design‌ refers to circuit boards designed for transmitting high-speed signals, which are usually transmitted at speeds in GHz (gigahertz).
Intel's strongest black technology strikes: Flash cache debut
In mid-March 2017, Intel officially released the new SSD DC P4800X based on Optane flash technology, which is targeted for data center applications. Alibaba and Tencent were first deployed.
"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017
With the emergence of new technologies such as the Internet of Things and cloud computing, a series of new changes have occurred in the manufacturing industry in 2016.
Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China
In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry
The future of China's "Core" will be more bright
Just as steel supports the industry, chips support the information industry. Chip R&D and manufacturing capability is the embodiment of a country's high, sophisticated and cutting-edge technology development level.

XC6VLX75T-3FFG484C Manufacturers

Related Products

Hot Products

TCME687M006R0012

PCM5102AQPWRQ1

EP2AGX95EF35C5N

EP2S60F672I4N

MAX3362EKA+T

MT41K1G8SN-125:A

What is the future development prospect of chips in China

What is a high-speed PCB design?

Intel's strongest black technology strikes: Flash cache debut

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

The future of China's "Core" will be more bright

Jenny 2025-10-26 21:33:11

Audrey 2020-07-04 01:21:19

Elizabeth 2021-02-18 07:00:40

Caroline 2022-01-16 20:42:37

Georgia 2024-02-04 18:32:37

Christine 2020-12-04 20:54:15

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.