XC6VLX550T-2FFG1759C Manufacturers

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XC6VLX550T-2FFG1759C, Relying on superior quality and excellent post-sales, our items sell well in America, Europe, the Middle East and South Africa. We're also the appointed OEM factory for several worlds' famous merchandise brands. Welcome to contact us for further negotiation and cooperation.

Hot Products

  • CY7C2644KV18-333BZI

    CY7C2644KV18-333BZI

    CY7C2644KV18-333BZI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56846A1KFTBLG

    BCM56846A1KFTBLG

    BCM56846A1KFTBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture). Processing System (PS) and Xilinx Programmable Logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • EP3SL110F780C3G

    EP3SL110F780C3G

    ​EP3SL110F780C3G is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 110,000 Logic Elements, operates at a speed of up to 660 MHz, and features 4.6 Mb of embedded memory, 172 DSP blocks, and 12 high-speed transceiver channels.
  • XCVU13P-2FSGA2577I

    XCVU13P-2FSGA2577I

    ​XCVU13P-2FSGA2577I is an FPGA (Field Programmable Gate Array) produced by Xilinx. It belongs to the Kintex UltraScale+series and has the following features and specifications:
  • XCVU13P-2FLGA2577E

    XCVU13P-2FLGA2577E

    ​XCVU13P-2FLGA2577E Virtex™ UltraScale+ ™ The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements

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