XC6SLX9-3TQG144C Manufacturers

The very rich projects management experiences and one to one service model make the high importance of business communication and our easy understanding of your expectations for XC6SLX9-3TQG144C, Our tenet is evident each of the time: to provide good quality solution at competitive rate to clients throughout the planet. We welcome potential purchasers to call us for OEM and ODM orders.
XC6SLX9-3TQG144C, We adopted technique and quality system management, based on ""customer orientated, reputation first, mutual benefit, develop with joint efforts"", welcome friends to communicate and cooperate from all over the world.

Hot Products

  • XC7Z045-2FFG676E

    XC7Z045-2FFG676E

    ​XC7Z045-2FFG676E is a high-performance FPGA chip launched by Xilinx, which has the characteristics of high-speed processing capability, low power consumption, and high integration, and is suitable for various applications in modern communication systems. This chip is based on the ARM Cortex-A9 core
  • XCKU15P-2FFVE1517I

    XCKU15P-2FFVE1517I

    XCKU15P-2FFVE1517I is an FPGA (Field Programmable Gate Array) chip from Xilinx, which belongs to the Kintex UltraScale+ family. The chip utilizes 20nm process technology and features 1.4 million logic cells and 5,520 DSP slices.
  • B15951B0KUB92GT

    B15951B0KUB92GT

    B15951B0KUB92GT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-2CSGA324I

    XC7S50-2CSGA324I

    ​XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits

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