XC3S50-4TQG144I Manufacturers

With our leading technology as well as our spirit of innovation,mutual cooperation, benefits and development, we will build a prosperous future together with your esteemed company for XC3S50-4TQG144I, Our final target is "To consider the most effective, To be the Best". Please experience cost-free to call with us if you have any prerequisites.
XC3S50-4TQG144I, We always insist on the management tenet of "Quality is first, Technology is basis, Honesty and Innovation".We've been able to develop new products and solutions continuously to a higher level to satisfy different needs of customers.

Hot Products

  • IT988GSETC PCB

    IT988GSETC PCB

    IT988GSETC PCB design technology has become a design method that electronic system designers must adopt. Only by using the design techniques of high-speed circuit designers can the controllability of the design process be achieved. The following is about IT988GSETC PCB related, I hope to help you better understand IT988GSETC PCB.
  • MT53E128M32D2FW-046 WT:A

    MT53E128M32D2FW-046 WT:A

    MT53E128M32D2FW-046 WT:A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Medical PCBA

    Medical PCBA

    HONTEC has 30 medical PCBA production lines such as Panasonic and Yamaha, Germany ersa selective wave soldering, solder paste detection 3D SPI, AOI, X-ray, BGA repair table and other equipment.
  • 5M570ZT144C5N

    5M570ZT144C5N

    ​The 5M570ZT144C5N low-cost and low-power CPLD provides greater density and I/O per footprint. The density of MAX V devices ranges from 40 to 2210 logic elements (32 to 1700 equivalent macro units) and up to 271 I/O, providing programmable solutions for I/O expansion, bus and protocol bridging, power monitoring and control, FPGA configuration, and analog IC interfaces.
  • BCM56275A1KFSBG

    BCM56275A1KFSBG

    BCM56275A1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements

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