XC3S400A-4FTG256C Manufacturers

We'll make each individual effort to become exceptional and ideal, and speed up our steps for standing inside the rank of worldwide top-grade and high-tech enterprises for XC3S400A-4FTG256C, We warmly welcome friends from all walks of life to cooperate with us.
XC3S400A-4FTG256C, We strongly believe that technology and service is our base today and quality will create our reliable walls of future. Only we've got better and better quality , could we achieve our customers and ourselves, too. Welcome customers all over the word to contact us for getting further business and reliable relationships. We've been always here working for your demands whenever you need to have.

Hot Products

  • AD8348ARUZ

    AD8348ARUZ

    AD8348ARUZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572-10TQG100C

    XC9572-10TQG100C

    XC9572-10TQG100C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7VX330T-2FFG1157C

    XC7VX330T-2FFG1157C

    XC7VX330T-2FFG1157C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 6G PCB

    6G PCB

    6G PCB needs not only high-speed components, but also genius and careful design. The importance of device simulation is the same as that of digital. In high speed system, noise is a basic consideration. High frequency will produce radiation and then interference.
  • XC3S50AN-4TQG144C

    XC3S50AN-4TQG144C

    XC3S50AN-4TQG144C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Megtron7 PCB

    Megtron7 PCB

    Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.

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