XC3S200AN-4FT256I Manufacturers

We now have a specialist, efficiency workforce to deliver excellent service for our purchaser. We always follow the tenet of customer-oriented, details-focused for XC3S200AN-4FT256I, Besides, our firm sticks to high quality and affordable cost, and we also present great OEM companies to many famous brands.
XC3S200AN-4FT256I, Faced with the vitality of the global wave of economic integration, we are confident with our high-quality products and sincerely service to all our customers and wish we can cooperate with you to create a brilliant future.

Hot Products

  • BCM56445XBOKFSBLG

    BCM56445XBOKFSBLG

    BCM56445XBOKFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K70T-2FBG676I

    XC7K70T-2FBG676I

    XC7K70T-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Medical PCBA

    Medical PCBA

    HONTEC has 30 medical PCBA production lines such as Panasonic and Yamaha, Germany ersa selective wave soldering, solder paste detection 3D SPI, AOI, X-ray, BGA repair table and other equipment.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
  • XCVU7P-2FLVB2104I

    XCVU7P-2FLVB2104I

    ​XCVU7P-2FLVB2104I is an FPGA chip produced by Xilinx, belonging to Xilinx's XCVU7P series. This chip has high-speed connectivity capabilities and supports 150G Interlake and 100G Ethernet MAC cores, enabling high-speed data transmission and processing.

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