Products
Home > Products > XC2VP20-6FF1152I

XC2VP20-6FF1152I Manufacturers

Being supported by an highly developed and specialist IT team, we could give technical support on pre-sales & after-sales service for XC2VP20-6FF1152I, Standing still today and seeking into the longer term, we sincerely welcome customers all over the environment to cooperate with us.
XC2VP20-6FF1152I, All styles appear on our website are for customizing. We meet up to private requirements with all items of your very own styles. Our concept is to help presenting the confidence of each buyers with the offering of our most sincere service, and the right product.

Related Products

Hot Products

  • XCKU040-2FBVA676E

    XCKU040-2FBVA676E

    ​XCKU040-2FBVA676E is a Kintex based ® The UltraScale architecture FPGA (Field Programmable Gate Array) chip is produced by AMD (formerly Xilinx). It has high performance and flexible programmability, suitable for a wide range of application fields such as data centers
  • LT8336HV#PBF

    LT8336HV#PBF

    LT8336HV#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I
  • XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10AS066H3F34I2LG

    10AS066H3F34I2LG

    ​10AS066H3F34I2LG is an FPGA (Field Programmable Gate Array) product manufactured by Altera (now part of Intel). Here is a detailed introduction about 10AS066H3F34I2LG
  • 10AS022C4U19E3LG

    10AS022C4U19E3LG

    ​10AS022C4U19E3LG is an electronic component, specifically belonging to Intel's package type 484-BFBGA batch 24+products. This component may be a programmable logic device, microprocessor, integrated circuit (IC), or other type of electronic component used in various electronic devices
  • Related Blog
  • Reviews

  • PCB production, you must pay attention to these matters

    Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

  • HDI board market supply and demand analysis

    The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

  • The source of the name of the HDI Board

    HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.

  • Film selection of FPC circuit board

    At present, the coating method of resist is divided into the following three methods according to the precision and output of circuit graphics: screen missing printing method, dry film / photosensitive method and liquid resist photosensitive method.

  • What is semiconductor

    Substances and materials in nature can be divided into three categories: conductors, semiconductors and insulators according to their conductivity. The resistivity of semiconductor is in the range of 1m Ω· cm ~ 1g Ω· cm (the upper limit is taken according to Xie jiakui's electronic circuit, and 1/10 or 10 times of it; because the angle mark is not available, the current description is used temporarily)

  • Introduction to semiconductor

    Germanium, silicon, selenium, gallium arsenide and many metal oxides, metal sulfides and other objects, whose conductivity is between conductor and insulator, are called semiconductors. Semiconductors have some special properties. For example, the thermistor (thermistor) for automatic control can be made by using the relationship between the resistivity and temperature of the semiconductor; Using its photosensitive characteristics, photosensitive elements for automatic control can be made, such as photocells, photocells and photoresistors

Send Inquiry