TXS0102DCUR Manufacturers

XC7A35T-1FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

HI-1573PCIF integrated circuit, abbreviated as IC; as the name implies, a certain number of commonly used electronic components, such as resistors, capacitors, transistors, etc., as well as the wiring between these components, are integrated by semiconductor technology to have specific functions.

XC2VP20-6FF1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCZU47DR-2FSVG1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Electronic design is constantly improving the performance of the whole machine, but also trying to reduce its size. From mobile phones to smart weapons, "small" is the eternal pursuit. High density integration (HDI) technology can make terminal product design more miniaturized, while meeting higher standards of electronic performance and efficiency. Welcome to buy 6-Layer HDI PCB from us.