Products
Home > Products > Series: XCVU190

Series: XCVU190 Manufacturers

"Based on domestic market and expand overseas business" is our enhancement strategy for Series: XCVU190,Model number:XCVU13P-2FLGA2577I,Manufacturer: XILINX,Package: FBGA-2577, Currently, we are seeking ahead to even bigger cooperation with abroad buyers determined by mutual benefits. Please sense absolutely free to contact us for more details.
Series: XCVU190, Our mission is to deliver consistently superior value to our customers and their clients. This commitment permeates everything we do, driving us to continuously develop and improve our solutions and the processes to fulfill your needs.

Related Products

Hot Products

  • LTC3636IUFD#TRPBF

    LTC3636IUFD#TRPBF

    LTC3636IUFD#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADM3260ARSZ

    ADM3260ARSZ

    ADM3260ARSZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56454B1IFSBG

    BCM56454B1IFSBG

    BCM56454B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • IMX477-AACK-C

    IMX477-AACK-C

    IMX477-AACK-C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT40A512M16TB-062E:R

    MT40A512M16TB-062E:R

    MT40A512M16TB-062E:R is a high-speed dynamic random access memory that is configured internally as 8 sets of DRAM in x16 configuration and 16 sets of DRAM in x4 and x8 configuration. DDR4 SDRAM uses the 8n refresh architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transmit two data words per clock cycle on the I/O pins.
  • XCV300E-6BG352C

    XCV300E-6BG352C

    XCV300E-6BG352C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • What does IC mean

    Integrated circuit (IC), sometimes called chip or microchip, is a semiconductor wafer on which thousands of micro resistors, capacitors and transistors are manufactured. An integrated circuit can function as an amplifier, oscillator, timer, counter, computer memory, or microprocessor. Specific ICs are classified as linear (Analog) or digital according to their intended applications.

  • PCB factory Jianding is aggressively attacking the automotive board market and plans to spend 3 billion yuan to expand the capacity of the Hubei Xiantao plant

    PCB factory Jianding Technology is aggressively attacking the automotive board field. On the 21st, the company's board of directors approved a capital increase of 100 million US dollars (about NTD 3 billion) in China's Hubei Xiantao Plant. Demand, the monthly production capacity of 400,000 square feet is expected to be launched in the second quarter.

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

    In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry

  • Technology of FPC circuit board shape and hole machining

    At present, punching is the most used in batch processing of FPC circuit boards, and NC drilling and milling is mainly used for small batch FPC circuit boards and FPC circuit board samples

  • Heavy copper PCB manufacturing

    Just like the standard PCB manufacturing method, heavy copper PCB manufacturing requires more delicate processing.

Send Inquiry