Ro4730G3 PCB Manufacturers

To be a result of ours specialty and repair consciousness, our corporation has won a good popularity amid consumers everywhere in the environment for Ro4730G3 PCB,Ro4003C PCB,Ro4350B PCB,Ro4360G2 PCB,Ro4533 PCB, We welcome an prospect to do small business along with you and hope to have pleasure in attaching further particulars of our merchandise.
Ro4730G3 PCB, Taking the core concept of "to be the Responsible". We will redound up on society for high quality solutions and good service. We are going to initiative to participate in international competition to be a first- class manufacturer of this product in the world.

Hot Products

  • ENEPIG PCB

    ENEPIG PCB

    ENEPIG PCB is the abbreviation of gold plating, palladium plating and nickel plating. ENEPIG PCB coating is the latest technology used in electronic circuit industry and semiconductor industry. The gold coating with thickness of 10 nm and palladium coating with thickness of 50 nm can achieve good conductivity, corrosion resistance and friction resistance.
  • EP4SGX290NF45C3N

    EP4SGX290NF45C3N

    EP4SGX290NF45C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU15P-2FFVA1156I

    XCKU15P-2FFVA1156I

    ​XCKU15P-2FFVA1156I Kintex® UltraScale+ ™ The device provides high cost-effectiveness in FinFET nodes. This FPGA series is an ideal choice for packet processing and DSP intensive functions, and is suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.
  • HI-6131PQM

    HI-6131PQM

    Interface Function: HI-6131PQM provides a complete interface between the main processor and MIL-STD-1553B bus, supporting single or multi-functional operations. Each IC contains a bus controller (BC), a bus monitoring terminal (MT), and two independent remote terminals (RT), which can operate concurrently
  • CY7C2665KV18-450BZI

    CY7C2665KV18-450BZI

    CY7C2665KV18-450BZI integrated circuit, is the memory chip of CYPRESS, storage capacity: 144Mbit, power: 450MHZ, package: 165-FBGA
  • ADM232AARNZ

    ADM232AARNZ

    ADM232AARNZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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