Products
Home > Products > Ro4730G3 PCB

Ro4730G3 PCB Manufacturers

To be a result of ours specialty and repair consciousness, our corporation has won a good popularity amid consumers everywhere in the environment for Ro4730G3 PCB,Ro4003C PCB,Ro4350B PCB,Ro4360G2 PCB,Ro4533 PCB, We welcome an prospect to do small business along with you and hope to have pleasure in attaching further particulars of our merchandise.
Ro4730G3 PCB, Taking the core concept of "to be the Responsible". We will redound up on society for high quality solutions and good service. We are going to initiative to participate in international competition to be a first- class manufacturer of this product in the world.

Related Products

Hot Products

  • XC7A75T-2FGG484I

    XC7A75T-2FGG484I

    XC7A75T-2FGG484I is a field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 52,160 logic cells, 2.7 Mb of block RAM, and 240 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1000 MHz. The device comes in a fine-pitch ball grid array (FGG484I) package with 484 pins, providing high pin-count connectivity for a variety of applications. XC7A75T-2FGG484I is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for high-speed and high-reliability applications.
  • XC6SLX45T-3FGG484I

    XC6SLX45T-3FGG484I

    XC6SLX45T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400-4FTG256C

    XC3S400-4FTG256C

    XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • AD7710ARZ

    AD7710ARZ

    AD7710ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTM4650AEY#PBF

    LTM4650AEY#PBF

    LTM4650AEY#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Film selection of FPC circuit board

    There are three methods of resist coating: liquid resist coating method and FPC resist coating method for circuit board

  • Semiconductor refrigeration technology

    Semiconductor refrigeration technology is widely used in the current refrigeration technology. During the growth of crops in the greenhouse, semiconductor refrigeration technology can effectively control the environmental temperature, especially for some plants with high requirements for the environment

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • Plug hole processing technology sharing

    The term "plug hole" is not a new term for the printed circuit board industry.

  • High Frequency PCB processing attention points

    High Frequency PCB processing attention points.

  • The development path of Chinese PCB companies

    From the choice of Hongtai's own development path, we are also practicing a differentiated development model.

Send Inquiry