RO4003C high frequency PCB Manufacturers

With state-of-the-art technologies and facilities, strict high-quality management, reasonable price tag, top-quality service and close co-operation with clients, we're devoted to delivering the top value for our consumers for RO4003C high frequency PCB,VT-481 PCB,RO3003 high frequency PCB, To find out more about what we could do for you personally, call us anytime. We look forward to setting up good and long-term company interactions along with you.
RO4003C high frequency PCB, Our tenet is "integrity first, quality best". We have confidence in providing you with excellent service and ideal products. We sincerely hope we can establish win-win business cooperation with you in the future!

Hot Products

  • 10AX027H3F35E2SG

    10AX027H3F35E2SG

    10AX027H3F35E2SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX550T-3FFG1760C

    XC6VLX550T-3FFG1760C

    ​XC6VLX550T-3FFG1760C is a Virtex-6 series FPGA chip produced by Xilinx. The chip is packaged in FCBGA-1760, with 549888 logic units, supporting up to 1200 user input/output ports, and built-in 23298048 bit memory RAM. Its working power supply voltage range is 0.9V to 1.05V, a
  • EP3C55F484I7N

    EP3C55F484I7N

    EP3C55F484I7N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 55,000 Logic Elements, operates at a speed of up to 350 MHz, and features 360Kb of embedded memory, 204 DSP blocks, and 4 PLLs. It is commonly used in a range of applications, including motor control, sensory data aggregation, and low-power embedded processing.
  • XCVU9P-1FSGD2104E

    XCVU9P-1FSGD2104E

    XCVU9P-1FSGD2104E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU040-1FFVA1156E

    XCKU040-1FFVA1156E

    ​XCKU040-1FFVA1156E also adopts advanced 16 nanometer technology, which can achieve higher integration and lower power consumption. In addition, the chip also has high programmability and flexibility, which can meet the needs of different application scenarios.
  • 8OZ Heavy copper PCB

    8OZ Heavy copper PCB

    In PCB proofing, a layer of copper foil is bonded to the outer layer of FR-4. When the copper thickness is = 8oz, it is defined as a 8OZ heavy copper pcb. The 8OZ heavy copper pcb has excellent extension performance, high temperature, low temperature, and corrosion resistance, which allows electronic equipment products to have a longer service life, and also greatly helps the size of electronic equipment to be simplified. In particular, electronic products that need to run higher voltages and currents require 8OZ heavy copper pcb.

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