R-5775N high-speed PCB Manufacturers

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R-5775N high-speed PCB, We also provide OEM service that caters to your specific needs and requirements. With a strong team of experienced engineers in hose design and development, we value every opportunity to provide best products for our customers.

Hot Products

  • XC6SLX150T-N3FGG676I

    XC6SLX150T-N3FGG676I

    ​XC6SLX150T-N3FGG676I is a high-performance FPGA chip with a wide range of applications, including communication, data centers, image processing, and radar systems. This chip has high performance and flexibility, and can achieve high-speed signal processing
  • EPM3128ATC100-10N

    EPM3128ATC100-10N

    EPM3128ATC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6VLX240T-2FFG1156I

    XC6VLX240T-2FFG1156I

    ​XC6VLX240T-2FFG1156I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • BCM65230C0IFSBG

    BCM65230C0IFSBG

    BCM65230C0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • XCZU5CG-L1SFVC784I

    XCZU5CG-L1SFVC784I

    ​XCZU5CG-L1SFVC784I has 64 bit processor scalability, combining real-time control with software and hardware engines for graphics, video, waveform, and packet processing. Multi processor on-chip system devices are built on standard real-time processors and platforms equipped with programmable logic.

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