MTA18ASF4G72HZ-3G2F1 Manufacturers

Our products are broadly identified and trustworthy by people and may meet continually modifying financial and social requires of MTA18ASF4G72HZ-3G2F1, We have been also the appointed OEM factory for several worlds' famous merchandise brands. Welcome to call us for even further negotiation and cooperation.
MTA18ASF4G72HZ-3G2F1, In order to meet our market demands, we now have paied more attention to the quality of our products and solutions and services. Now we can meet customers' special requirements for special designs. We persistently develop our enterprise spirit "quality lives the enterprise, credit assures cooperation and keep the motto in our minds: customers first.

Hot Products

EP3C10E144I7N
EP3C10E144I7N FPGA Field Programmable Logic Device Altera Packaging Original Factory Packaging Batch 22+
HI-8684PST
HI-8684PST is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
P2041NSE7MMC
P2041NSE7MMC is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
HI-1579PSI
HI-1579PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7VX690T-2FFG1761C
XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
XC7VX330T-2FFG1157C
XC7VX330T-2FFG1157C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Reviews

Circuit thinning drives high-end micro-drill business opportunities
Due to the continuous introduction of thin, light and short products in the market, the high-function, high-speed and other double-height era has been developed, and the trend of high-frequency, high-speed, and multi-IO chips has been developed.
Development history of electronic components
The development history of electronic components is actually a condensed history of electronic development. Electronic technology is a new technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and been widely used in the 20th century. It has become an important symbol of the development of modern science and technology.
Classification of chips
Chip classification Is there a systematic classification method for so many chips? There are actually many ways to classify chips
Installation mode of components on PCB printed circuit board
Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular
This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history
According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years
Huawei Yu Chengdong: P10 sales to break 10 million to catch up with Apple
At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.

MTA18ASF4G72HZ-3G2F1 Manufacturers

Related Products

Hot Products

EP3C10E144I7N

HI-8684PST

P2041NSE7MMC

HI-1579PSI

XC7VX690T-2FFG1761C

XC7VX330T-2FFG1157C

Circuit thinning drives high-end micro-drill business opportunities

Development history of electronic components

Classification of chips

Installation mode of components on PCB printed circuit board

This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history

Huawei Yu Chengdong: P10 sales to break 10 million to catch up with Apple

Joanne 2024-06-04 18:29:01

Isabel 2022-08-14 00:29:52

Gemma 2021-03-06 04:36:48

Betty 2022-08-30 17:24:05

Cherry 2024-10-07 20:37:55

Elma 2021-08-19 10:45:18

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.