ISOLA Tachyon 100G high speed board Manufacturers

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Hot Products

  • XC6SLX150-2FGG484C

    XC6SLX150-2FGG484C

    XC6SLX150-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM6803FB0KFSBG

    BCM6803FB0KFSBG

    BCM6803FB0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-2FFG676I

    XC7K325T-2FFG676I

    ​The XC7K325T-2FFG676I field programmable gate array, after optimization, has the best cost-effectiveness, which is twice as high as the previous generation product, realizing a new type of FPGA.
  • 88E1111-B2-BAB2I000

    88E1111-B2-BAB2I000

    88E1111-B2-BAB2I000 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT47H64M16NF-25E:M

    MT47H64M16NF-25E:M

    MT47H64M16NF-25E:M is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU060-2FFVA1517E

    XCKU060-2FFVA1517E

    ​XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.

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