ISOLA FR408HR Circuit Board Manufacturers

We continuously execute our spirit of ''Innovation bringing development, Highly-quality ensuring subsistence, Management advertising and marketing gain, Credit history attracting buyers for ISOLA FR408HR Circuit Board,FR406 PCB,370HR with mixed PCB,RO3003 with mixed PCB,ISOLA FR408HR PCB, Our business has already setup a professional, creative and responsible workforce to develop purchasers together with the multi-win principle.
ISOLA FR408HR Circuit Board, We maintain long-term efforts and self-criticism, which helps us and improvement constantly. We strive to improve customer efficiency to save costs for customers. We do our best to improve the quality of product. We'll not live up to the historic opportunity of the times.

Hot Products

  • Ladder PCB

    Ladder PCB

    Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
  • MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • XAZU2EG-1SFVA625Q

    XAZU2EG-1SFVA625Q

    XAZU2EG-1SFVA625Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572XL-10TQG100I

    XC9572XL-10TQG100I

    XC9572XL-10TQG100I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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