Ic carrier Manufacturers

With our excellent management, strong technical capability and strict quality control system, we continue to provide our clients with reliable quality, reasonable prices and excellent services. We aim at becoming one of your most reliable partners and earning your satisfaction for Ic carrier,Ic substrate,BT PCB,BT Board,DS7409 PCB, Welcome your browsing and any your inquires,sincerely hope we are able to have chance to cooperate with you and we will build-up extensive effectively company marriage along with you.
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Hot Products

  • XCKU19P-L2FFVJ1760E

    XCKU19P-L2FFVJ1760E

    XCKU19P-L2FFVJ1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX95EF29C5N

    EP2AGX95EF29C5N

    EP2AGX95EF29C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Bluetooth Module PCB

    Bluetooth Module PCB

    Bluetooth module is a PCBA board with integrated Bluetooth function for short-range wireless communication. It is divided into Bluetooth data module and Bluetooth voice module by function.The following is about Bluetooth Module HDI PCB related, I hope to help you better understand Bluetooth Module PCB
  • Buried Copper Coin PCB

    Buried Copper Coin PCB

    The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.
  • XCKU095-L1FFVB1760I

    XCKU095-L1FFVB1760I

    XCKU095-L1FFVB1760I The specific technical specifications and features may vary depending on the supplier, manufacturing batch, and configuration options.
  • EP3SL150F1152C4N

    EP3SL150F1152C4N

    EP3SL150F1152C4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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