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Our solutions are greatly recognized and reliable by customers and will fulfill continuously altering financial and social requirements for High-precision PCB,High-speed PCB,TU-752 PCB,Backdrill PCB,High-frequency PCB, The continual availability of substantial grade products and solutions in combination with our fantastic pre- and after-sales services ensures strong competitiveness in an increasingly globalized current market.
High-precision PCB, Our company has abundant strength and possesses a steady and perfect sales network system. We wish we could establish sound business relationships with all customers from at home and abroad on the basis of mutual benefits.

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  • MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
  • XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I Field Programmable Gate Array (FPGA) is a device that utilizes stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Virtex-7 is suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • MAX13082EESA+

    MAX13082EESA+

    MAX13082EESA+ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Large size HDI PCB

    Large size HDI PCB

    The buried hole is not necessarily HDI. Large size HDI PCB first-order and second-order and third-order how to distinguish the first-order is relatively simple, the process and process are easy to control. Second order began to trouble, one is the problem of alignment, a hole and copper plating problem.
  • TMS3705GDRQ1

    TMS3705GDRQ1

    TMS3705GDRQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LMH0340SQE/NOPB

    LMH0340SQE/NOPB

    LMH0340SQE/NOPB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • Reviews

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

  • What is an integrated circuit

    Integrated circuit is a way of miniaturization of circuits (mainly including semiconductor equipment, also including passive components, etc.). Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected, fabricated on a small or several small semiconductor chips or dielectric substrates,

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular.

  • Definition of PCB

    PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.

  • The world's top three chip manufacturers

    Under the background of chip shortage, chip is becoming a crucial field in the world. In the chip industry, Samsung and Intel have always been the world's largest IDM giants (integrating design, manufacturing and sealing and testing, basically without relying on others). For a long time, the Iron Throne of global chips was fought back and forth between the two until TSMC rose and the bipolar pattern was completely broken.

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

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