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Hot Products

  • XCVU7P-2FLVB2104E

    XCVU7P-2FLVB2104E

    ​XCVU7P-2FLVB2104E is a Field Programmable Gate Array (FPGA) developed by Xilinx, packaged in BGA-2104 format. This FPGA belongs to Virtex ™ The UltraScale+series, designed on 14nm/16nm FinFET nodes, provides high-performance and highly integrated functionality.
  • XCKU15P-3FFVE1517E

    XCKU15P-3FFVE1517E

    ​XCKU15P-3FFVE1517E Kintex® UltraScale+ ™ FPGA provides high cost-effectiveness in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores.
  • XC7Z015-2CLG485I

    XC7Z015-2CLG485I

    XC7Z015-2CLG485I is an SOC chip produced by Xilinx, which is an integrated system chip based on the Zynq-7000 architecture. The chip integrates a dual core ARM Cortex-A9 MPCore processor and CoreSight system, as well as an Artix-7 FPGA, with a total of 74K logic units and a running frequency of up to 766MHz
  • XCKU040-2FFVA1156I

    XCKU040-2FFVA1156I

    ​XCKU040-2FFVA1156I is an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • XC3S250E-4TQG144I

    XC3S250E-4TQG144I

    XC3S250E-4TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10 layers of HDI PCB

    10 layers of HDI PCB

    HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.The following is about 10 layers of HDI PCB, I hope to help you better understand 10 layers of HDI PCB.

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