EP4CE75F29C6N Manufacturers

"Quality 1st, Honesty as base, Sincere company and mutual profit" is our idea, in an effort to create consistently and pursue the excellence for EP4CE75F29C6N, We normally welcome new and outdated customers presents us with worthwhile advice and proposals for cooperation, allow us to develop and acquire jointly, also to contribute to our local community and staff!
EP4CE75F29C6N, Besides strong technical strength, we also introduce advanced equipment for inspection and conduct strict management. All the staff of our company welcome friends both at home and abroad to come for visits and business on the basis of equality and mutual benefit. If you are interested in any of our objects, remember to feel free to contact us for quotation and product details.

Hot Products

  • 10AX048H3F34I2LG

    10AX048H3F34I2LG

    10AX048H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 20layer 5G PCB

    20layer 5G PCB

    20layer 5G PCB--The increase in the density of integrated circuit packaging has led to a high concentration of interconnect lines, which makes the use of multiple substrates a necessity. In the layout of the printed circuit, unforeseen design problems have appeared, such as noise, stray capacitance, and crosstalk. The following is about 20 layer Pentium Motherboard related, I hope to help you better understand 20-layer PCB.
  • 8308AGILF

    8308AGILF

    8308AGILF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150-3FGG676I

    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
  • MT48LC64M8A2P-75IT:C

    MT48LC64M8A2P-75IT:C

    MT48LC64M8A2P-75IT:C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU125-2FLVC2104E

    XCVU125-2FLVC2104E

    ​XCVU125-2FLVC2104E The XCCU125-2FLVC2104E device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation

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