Products
Home > Products > EP4CE30F23C8N

EP4CE30F23C8N Manufacturers

We're going to make each individual work being remarkable and ideal, and accelerate our steps for standing during the rank of worldwide top-grade and high-tech enterprises for EP4CE30F23C8N, Welcome all nice buyers communicate details of products and ideas with us!!
EP4CE30F23C8N, Now, we are trying to enter new markets where we do not have a presence and developing the markets we have now the already penetrated. On account of superior quality and competitive price , we'll be the market leader, please don??￥t hesitate to contact us by phone or email, if you are interested in any of our goods.

Related Products

Hot Products

  • XC7A200T-2FFG1156C

    XC7A200T-2FFG1156C

    XC7A200T-2FFG1156C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD8561ARZ

    AD8561ARZ

    AD8561ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • REF192ESZ

    REF192ESZ

    REF192ESZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM3128ATC144-10N

    EPM3128ATC144-10N

    EPM3128ATC144-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ADUC812BSZ

    ADUC812BSZ

    ADUC812BSZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM63136RVKFEBG

    BCM63136RVKFEBG

    BCM63136RVKFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • FPC soft board process introduction

    Overview of FPC soft board automatic production line

  • How to fix the integrated circuit problem

    The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.

  • Main Classification of Chips

    According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.

  • The source of the name of the HDI Board

    HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.

  • The Function and Principle of Chips

    The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.

  • Welding process of FPC circuit board

    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding

Send Inquiry