EP4CE22E22C8N Manufacturers

We thinks what prospects think, the urgency of urgency to act from the interests of a client position of theory, allowing for greater high-quality, reduced processing costs, rates are much more reasonable, won the new and previous consumers the support and affirmation for EP4CE22E22C8N, The continual availability of substantial grade goods in combination with our exceptional pre- and after-sales support ensures strong competitiveness in an increasingly globalized marketplace.
EP4CE22E22C8N, Our aim is to help customers realize their goals. We have been making great efforts to achieve this win-win situation and sincerely welcome you to join us. In a word, when you choose us, you choose a perfect life. Welcome to visit our factory and welcome your order! For further inquiries, remember to do not hesitate to contact us.

Hot Products

  • 10AX048H3F34I2LG

    10AX048H3F34I2LG

    10AX048H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 20layer 5G PCB

    20layer 5G PCB

    20layer 5G PCB--The increase in the density of integrated circuit packaging has led to a high concentration of interconnect lines, which makes the use of multiple substrates a necessity. In the layout of the printed circuit, unforeseen design problems have appeared, such as noise, stray capacitance, and crosstalk. The following is about 20 layer Pentium Motherboard related, I hope to help you better understand 20-layer PCB.
  • 8308AGILF

    8308AGILF

    8308AGILF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150-3FGG676I

    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
  • MT48LC64M8A2P-75IT:C

    MT48LC64M8A2P-75IT:C

    MT48LC64M8A2P-75IT:C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU125-2FLVC2104E

    XCVU125-2FLVC2104E

    ​XCVU125-2FLVC2104E The XCCU125-2FLVC2104E device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation

Send Inquiry