EP1S10F780C5N Manufacturers

Our enterprise since its inception, constantly regards product good quality as organization life, constantly improve production technology, strengthen merchandise high quality and continuously strengthen enterprise total good quality administration, in strict accordance with all the national standard ISO 9001:2000 for EP1S10F780C5N, "Quality first, Price lowest, Service best" is the spirit of our company. We sincerely welcome you to visit our company and negotiate mutual business!
EP1S10F780C5N, Now, we professionally supplies customers with our main products And our business is not only the "buy" and "sell", but also focus on more. We target to be your loyal supplier and long-term cooperator in China. Now, We hope to be the friends with you.

Hot Products

  • XC7Z030-1FBG484I

    XC7Z030-1FBG484I

    XC7Z030-1FBG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGXFB7K4F40I3N

    5AGXFB7K4F40I3N

    5AGXFB7K4F40I3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU125-3FLVB1760E

    XCVU125-3FLVB1760E

    XCVU125-3FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA
  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology

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