EP1K30FC256-3N Manufacturers

Our purpose would be to give good quality items at competitive rates, and top-notch service to consumers around the world. We are ISO9001, CE, and GS certified and strictly adhere to their quality specifications for EP1K30FC256-3N, Never-ending improvement and striving for 0% deficiency are our two main quality policies. Should you need anything, never hesitate to get in touch with us.
EP1K30FC256-3N, Relying on superior quality and excellent post-sales, our items sell well in America, Europe, the Middle East and South Africa. We're also the appointed OEM factory for several worlds' famous merchandise brands. Welcome to contact us for further negotiation and cooperation.

Hot Products

  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • XC7Z045-1FFG900I

    XC7Z045-1FFG900I

    ​XC7Z045-1FFG900I is a Zynq-7000 series System on a Chip (SoC) product produced by Xilinx. This chip has the following characteristics and specifications:
  • EP4CE55F23C6N

    EP4CE55F23C6N

    EP4CE55F23C6N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
  • MTC18F1045S1PC48BA2

    MTC18F1045S1PC48BA2

    MTC18F1045S1PC48BA2 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56643BOKFSBLG

    BCM56643BOKFSBLG

    BCM56643BOKFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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