BCM53115SIPB Manufacturers

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Hot Products

  • 10CL080YF780I7G

    10CL080YF780I7G

    ​10CL080YF780I7G is an FPGA (Field Programmable Gate Array) product produced by Intel. It has 423 I/O ports, packaged in 780-BGA (ball grid array), with a working voltage of 1.2V and a working temperature range of -40 ° C to 100 ° C.
  • DuPont FPC

    DuPont FPC

    DuPont FPC cable board is small in size and light in weight. DuPont material FPC cable board original design of the cable board was used to replace the larger wire harness wire. In the current cutting-edge electronic device assembly board,DuPont material FPC cable board is usually the only solution to meet the requirements of miniaturization and movement.
  • XCVU125-2FLVB2104I

    XCVU125-2FLVB2104I

    ​XCVU125-2FLVB2104I is a high-performance FPGA chip launched by Xilinx, belonging to the VERSAL series. This chip is manufactured using advanced technology, with a large number of logic components and adaptive logic modules, as well as abundant embedded memory resources
  • XCKU040-1FFVA1156C

    XCKU040-1FFVA1156C

    ​XCKU040-1FFVA1156C is a high-performance, low-power FPGA (Field Programmable Gate Array) chip that demonstrates strong application potential and is widely used in various fields such as industrial automation, smart homes, medical equipment, and transportation. With its high performance, low power consumption, and programmability, this chip plays an irreplaceable role in multiple fields.
  • EP2SGX130GF1508I5

    EP2SGX130GF1508I5

    EP2SGX130GF1508I5 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.

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