AP8525R FPC Manufacturers

​5SGXMA3H2F35C2G is an FPGA (Field Programmable Gate Array) chip produced by Intel/Altera. This chip has a specific packaging form, namely FBGA-1152 (35x35), which means it has 1152 pins arranged in a 35x35 matrix.

5CSXFC2C6U23I7N is dual ARM ® Cortex®-A9 MPCore ™ With CoreSight System on Chip (SOC) IC, Cyclone ® V SE FPGA -25K logic element, 800MHz, 672-UBGA (23x23)

XC6SLX9-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCZU47DR-L1FFVG1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

PTFE multilayer PCB--Agilent equipment provides customers with products for optical networks, transmission networks, broadband and data networks, wireless communication and microwave network types of networks and systems.The following is about Agilent equipment, I hope to help you better understand Agilent equipment.

In the era of rapid development of interconnected data and optical networks, 100G optical modules PCB , 200G optical modules PCB and even 400G optical modules PCB are constantly emerging. However, high speed has the advantages of high speed, and low speed also has the advantages of low speed. In the era of high-speed optical modules, 10G optical module PCB support the operations of manufacturers and users with their unique advantages and relatively low cost.10G optical module, as the name suggests, is an optical module that transmits 10G of data per second.According to inquiries: 10G optical modules are packaged in 300pin, XENPAK, X2, XFP, SFP+, and other packaging methods.