EM-891K HDI PCB is made of EM-891k material with the lowest loss of EMC brand by HONTEC. This material has the advantages of high speed, low loss and better performance.
ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.
The names of circuit board are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, heavy copper board, impedance board, PCB, ultra-thin circuit board,printed circuit board, etc.
The buried hole is not necessarily HDI. Large size HDI PCB first-order and second-order and third-order how to distinguish the first-order is relatively simple, the process and process are easy to control. Second order began to trouble, one is the problem of alignment, a hole and copper plating problem.
EM-888 HDI PCB is the abbreviation of high density interconnection. It is a kind of printed circuit board (PCB) production. It is a circuit board with high line distribution density using micro blind buried hole technology. EM-888 HDI PCB is a compact product designed for small capacity users.
