Products
Home > Products > 8-layer any interconnection HDI PCB

8-layer any interconnection HDI PCB Manufacturers

The very rich projects management experiences and one to one service model make the high importance of business communication and our easy understanding of your expectations for 8-layer any interconnection HDI PCB,22-layer ELIC HDI PCB,4-layer any layer HDI PCB, Our tenet is evident each of the time: to provide good quality solution at competitive rate to clients throughout the planet. We welcome potential purchasers to call us for OEM and ODM orders.
8-layer any interconnection HDI PCB, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our goods are favored by domestic and foreign customers. With your support, we are going to build a better tomorrow!

Related Products

Hot Products

  • TU-943N High-speed PCB

    TU-943N High-speed PCB

    TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10G optical module PCB

    10G optical module PCB

    In the era of rapid development of interconnected data and optical networks, 100G optical modules PCB , 200G optical modules PCB and even 400G optical modules PCB are constantly emerging. However, high speed has the advantages of high speed, and low speed also has the advantages of low speed. In the era of high-speed optical modules, 10G optical module PCB support the operations of manufacturers and users with their unique advantages and relatively low cost.10G optical module, as the name suggests, is an optical module that transmits 10G of data per second.According to inquiries: 10G optical modules are packaged in 300pin, XENPAK, X2, XFP, SFP+, and other packaging methods.
  • 5AGXFB3H4F35I5N

    5AGXFB3H4F35I5N

    5AGXFB3H4F35I5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8-layer rigid-Flex PCB

    8-layer rigid-Flex PCB

    8-layer rigid-Flex PCB has the characteristics of bending and folding, so it can be used to make customized circuit, maximize the indoor available space, use this point, reduce the space occupied by the whole system, the overall cost of rigid Flex PCB will be relatively high, but with the continuous maturity and development of the industry, the overall cost will continue to reduce, so it will be more cost-effective and competitive power.
  • 5CEBA7F23I7N

    5CEBA7F23I7N

    ​The 5CEBA7F23I7N is a Field-Programmable Gate Array (FPGA) device manufactured by Intel (formerly Altera Corporation). It belongs to the Cyclone V series, which is designed to accommodate shrinking power consumption, cost, and time-to-market requirements
  • Related Blog
  • Reviews

  • How to design a PCB for high frequency?

    Designing a PCB (Printed Circuit Board) for high-frequency applications requires careful consideration of various factors to ensure signal integrity, minimize losses, and mitigate electromagnetic interference. Here are some key steps and considerations:

  • How to distinguish the good and bad FPC board

    Methods to judge the quality of FPC circuit board: 1： Distinguish the quality of the circuit board from the appearance Generally, the appearance of FPC circuit board can be analyzed and judged from three aspects

  • How to choose reliable PCB manufacturers for cooperation

    The rise of 5g has driven the innovation, creation and rapid development of the global 3C industry. When more iterations of terminal products become very frequent and rapid, the common development of all core enterprises in the industrial chain becomes very important. 3C products focus on the quality effect and service life. Therefore, the parts and components in the products are very important. As one of the indispensable suppliers in the industrial chain, the buyer is also cautious in choosing.

  • PCB modular layout ideas

    Faced with the increasingly high integration of hardware platforms and more and more complex electronic systems, the PCB layout should have a modular thinking, which requires the use of modularity in the design of hardware schematics and PCB wiring. , Structured design method. As a hardware engineer, on the premise of understanding the overall architecture of the system, first of all, we should consciously merge modular design ideas in the schematic diagram and PCB wiring design, combined with the actual situation of the PCB, plan the basic idea of PCB layout.

  • Film selection of FPC circuit board

    There are three methods of resist coating: liquid resist coating method and FPC resist coating method for circuit board

  • HDI board market supply and demand analysis

    The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

Send Inquiry