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  • XC6SLX100-2FG484I

    XC6SLX100-2FG484I

    XC6SLX100-2FG484I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K410T-2FFG900I

    XC7K410T-2FFG900I

    ​XC7K410T-2FFG900I has optimized the best cost performance ratio, doubling compared to the previous generation, achieving a new class of FPGA.
  • XC4VFX40-11FFG1152I

    XC4VFX40-11FFG1152I

    XC4VFX40-11FFG1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX530NF45C2N

    EP4SGX530NF45C2N

    EP4SGX530NF45C2N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX360KF40C2N

    EP4SGX360KF40C2N

    EP4SGX360KF40C2N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • What the hell is a chip

    Chips are large-scale, microelectronic integrated circuits. That is, the printed circuit board is scaled down to nanometer (one millionth of a millimeter). On the front of the traditional printed circuit board, there are a large number of radio components, including triodes, diodes, capacitors, electrolysers, resistors, mid cycle regulators, switches, power amplifiers, detectors, filters, and so on.

  • What does the semiconductor industry do

    The semiconductor industry mainly focuses on integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion, and other fields. From the perspective of technology or economic development, the importance of semiconductors is enormous

  • What is a semiconductor and what is its purpose

    A semiconductor is a substance with a conductivity between that of a conductor and an insulator. It is not very conductive in a pure state, but its conductivity can be adjusted by adding impurities (doping) or changing the temperature. The typical representative of semiconductors is silicon, which is widely used in the manufacturing of electronic components. Semiconductor technology is the cornerstone of modern electronic devices, such as smartphones, computers, digital cameras, etc., all rely on semiconductor chips. In addition, semiconductors are also very important in the energy field, such as semiconductor materials, which are the core of solar cells

  • FPC circuit board manufacturing process

    Flow chart of single-sided FPC circuit board: engineering documents - copper foil - Pretreatment - press dry film - exposure - Development - etching - film stripping - AOI - Pretreatment - coating film (or ink printing) - pretreatment before electroplating - electroplating - post electroplating - reinforcement - appearance punching - electrical measurement - appearance inspection - shipment;

  • PCB single panel, double panel, multi-layer board can't tell the difference?

    A printed circuit board (PCB) is used to carry electronic components and provide a master circuit for connecting the components to the circuit. From the structural point of view, PCB is divided into single panel, double panel and multilayer board. But most people can't tell the difference, so what are the three differences?

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

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