18-Layer Rigid-Flex PCB Manufacturers

Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" along with the theory of "quality the basic, have confidence in the first and administration the advanced" for 18-Layer Rigid-Flex PCB,20-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,24-Layer Rigid-Flex PCB,26-Layer Rigid-Flex PCB, With the development of society and economy, our company will hold a tenet of "Focus on trust, quality the first", moreover, we assume to produce a wonderful foreseeable future with every customer.
18-Layer Rigid-Flex PCB, With the superior and exceptional service, we've been well developed along with our customers. Expertise and know-how ensure that we are always enjoying the trust from our customers in our business activities. "Quality", "honesty" and "service" is our principle. Our loyalty and commitments remain respectfully at your service. Contact Us Today For further information, contact us now.

Hot Products

  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MAX20050CATC/V+T

    MAX20050CATC/V+T

    MAX20050CATC/V+T is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Rogers Step PCB

    Rogers Step PCB

    Slots are formed on the surface of MDF or other plates to form decorative stripes or fixed pendants. The distance between the common groove board stripes is equal, it is processed by professional machine. Type for punching board.The following is about Rogers Step High Frequency PCB related, I hope to help you better understand Rogers Step PCB.
  • BCM88360A0IFSBLG

    BCM88360A0IFSBLG

    BCM88360A0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Communication PCBA

    Communication PCBA

    Communication PCBA is the abbreviation of printed circuit board + assembly, that is to say, PCBA is the whole process of PCB SMT, then dip plug-in.

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