16-layer large size PCB Manufacturers

We emphasize development and introduce new products into the market every year for 16-layer large size PCB,18-layer 5step HDI circuit board,14-layer lcross-blind buried via PCB,EM-890K PCB,EM-891K PCB, Living by quality, development by credit is our eternal pursuit, We firmly believe that after your visit we will become long-term partners.
16-layer large size PCB, To have much more enterprise. ompanions, we've got updated the item list and seek for optimistic co-operation. Our web-site shows the latest and complete information and facts about our merchandise list and company. For further acknowledge, our consultant service group in Bulgaria will reply to all of the inquiries and complications immediately. They're intending to make their finest effort to meet buyers require. Also we support the delivery of absolutely free samples. Business visits to our business in Bulgaria and factory are generally welcome for a win-win negotiation. Hope to expertise a happy company co-operation perform with you.

Hot Products

  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MAX20050CATC/V+T

    MAX20050CATC/V+T

    MAX20050CATC/V+T is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Rogers Step PCB

    Rogers Step PCB

    Slots are formed on the surface of MDF or other plates to form decorative stripes or fixed pendants. The distance between the common groove board stripes is equal, it is processed by professional machine. Type for punching board.The following is about Rogers Step High Frequency PCB related, I hope to help you better understand Rogers Step PCB.
  • BCM88360A0IFSBLG

    BCM88360A0IFSBLG

    BCM88360A0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Communication PCBA

    Communication PCBA

    Communication PCBA is the abbreviation of printed circuit board + assembly, that is to say, PCBA is the whole process of PCB SMT, then dip plug-in.

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