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  • ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.

  • Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.

  • 800G optical module PCB - at present, the transmission rate of global optical network is rapidly moving from 100g to 200g / 400g. In 2019, ZTE, China Mobile and Huawei respectively verified in Guangdong Unicom that single carrier 600g can achieve 48tbit / s transmission capacity of single fiber.

  • mmwave PCB-Wireless devices and the amount of data they process increase exponentially every year (53% CAGR). With the increasing amount of data generated and processed by these devices, the wireless communication mmwave PCB connecting these devices must continue to develop to meet the demand.

  • ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.

  • Halogen-free PCB -- halogen (halogen) is a group VII a non-gold Duzhi element in Bai, including five elements: fluorine, chlorine, bromine, iodine and astatine. Astatine is a radioactive element, and the halogen is usually referred to as fluorine, chlorine, bromine and iodine. Halogen-free PCB is environmental protection PCB does not contain the above elements.

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