AIN PCB have excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxicity, and thermal expansion coefficient matching with Si. AIN PCB will gradually replace traditional high-power LED base material and become A ceramic substrate material with the most future development. The most suitable heat dissipation substrate for AIN PCB
In PCB proofing, a layer of copper foil is bonded to the outer layer of FR-4. When the copper thickness is = 8oz, it is defined as a 8OZ heavy copper pcb. The 8OZ heavy copper pcb has excellent extension performance, high temperature, low temperature, and corrosion resistance, which allows electronic equipment products to have a longer service life, and also greatly helps the size of electronic equipment to be simplified. In particular, electronic products that need to run higher voltages and currents require 8OZ heavy copper pcb.
Tablet PC capacitive screen FPC: high light transmittance, multi-touch, not easy to scratch. However, the cost is high, and charge sensing can only be operated by fingertips. Oil, water vapor and other liquids can affect the touch operation. It can only be rotated 90 degrees or 180 degrees. HONTEC uses a new manufacturing method to improve the reliability of the installation and use of capacitive screen FPC, greatly improving the poor contact caused by the installation, the lamp is not bright, the black screen and other phenomena.
DuPont material FPC cable board is small in size and light in weight. DuPont material FPC cable board original design of the cable board was used to replace the larger wire harness wire. In the current cutting-edge electronic device assembly board,DuPont material FPC cable board is usually the only solution to meet the requirements of miniaturization and movement.
8-Layers AP7164E Rigid-Flex PCB is mainly used in various products such as mobile phones, digital cameras, tablets, notebook computers, wearable devices and so on. The application of FPC flexible circuit boards in smart phones accounts for a large proportion. Our company can skillfully produce multi-layer fpc, soft-hard combination fpc, multi-layer HDI soft-hard combination board. It has stable cooperation with HP, Dell, Sony, etc.
The IC carrier board is mainly used to carry the IC, and there are lines inside to conduct the signal between the chip and the circuit board. In addition to the function of the carrier, the IC carrier board also has a protection circuit, a dedicated line, a heat dissipation path, and a component module. Standardization and other additional functions.
