DS8502 PCB Manufacturers

Our commission is to serve our buyers and purchasers with most effective good quality and aggressive portable digital goods for DS8502 PCB,Ic carrier,Ic substrate,BT PCB,BT Board, Our experienced specialized group will be wholeheartedly at your support. We sincerely welcome you to check out our site and enterprise and send out us your inquiry.
DS8502 PCB, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which might be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we will continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Hot Products

  • XCKU3P-2FFVB676I

    XCKU3P-2FFVB676I

    ​The processing system of XCKU3P-2FFVB676I chip is very powerful and competitive for any available ASSP device. It supports complex architectures and can use a management program (guest operating system version running Linux) to perform various tasks such as control level,
  • BCM53344A0KFSBLG

    BCM53344A0KFSBLG

    BCM53344A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 4 Layer High Precision HDI PCB

    4 Layer High Precision HDI PCB

    This kind of PCB with a whole row of semi-metallized holes on the side of the board is characterized by a relatively small aperture. It is mostly used on the carrier board as a daughter board of the mother board. The feet are welded together.The following is about 4 Layer High Precision HDI PCB related, I hope to help you better understand 4 Layer High Precision HDI PCB.
  • XC95144XL-7TQG100I

    XC95144XL-7TQG100I

    XC95144XL-7TQG100I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM54210SB0KMLG

    BCM54210SB0KMLG

    BCM54210SB0KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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