XC7A200T-2FFG1156I Manufacturers

That has a positive and progressive attitude to customer's fascination, our enterprise constantly improves our merchandise high quality to meet the demands of customers and further focuses on safety, reliability, environmental requirements, and innovation of XC7A200T-2FFG1156I, Through our hard work, we have always been on the forefront of clean technology product innovation. We are a green partner you can rely on. Contact us today for more information!
XC7A200T-2FFG1156I, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which will be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we are going to continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Hot Products

  • 5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N is a field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor company. This device features 622,080 logic elements, 27 Mb of RAM, and 1,500 user input/output pins. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as single-ended I/O,
  • MC24M Buried capacitance PCB

    MC24M Buried capacitance PCB

    MC24M Buried capacitance PCB--Ordinary chip capacitors are placed on empty PCBs through SMT; buried capacitance is to integrate new buried capacitance materials into PCB / FPC, which can save PCB space and reduce EMI / noise suppression, etc. Currently answering MEMS microphones And communications have been widely used.The following is about MC24M Buried Capacitor PCB related, I hope to help you better understand MC24M Buried Capacitor PCB.
  • XC7VX980T-1FFG1928I

    XC7VX980T-1FFG1928I

    XC7VX980T-1FFG1928I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 4-Layer Rigid-Flex PCB

    4-Layer Rigid-Flex PCB

    4-Layer Rigid-Flex PCB In terms of equipment, due to the difference in material characteristics and product specifications, the equipment in the lamination and copper plating parts must be corrected. The applicability of the equipment will affect the yield and stability of the product, so it will enter the Rigid-Flex Before the production of the board, the suitability of the equipment must be considered. The following is about 4 Layer Rigid Flex PCB related, I hope to help you better understand 4 Layer Rigid Flex PCB.
  • XC7VX1140T-2FLG1928C

    XC7VX1140T-2FLG1928C

    XC7VX1140T-2FLG1928C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EM-890K HDI PCB

    EM-890K HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and laser direct drilling are used.The following is about EM-890K HDI PCB related, I hope to help you better understand EM-890K HDI PCB.

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