18-Layer Rigid-Flex PCB Manufacturers

Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" along with the theory of "quality the basic, have confidence in the first and administration the advanced" for 18-Layer Rigid-Flex PCB,20-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,24-Layer Rigid-Flex PCB,26-Layer Rigid-Flex PCB, With the development of society and economy, our company will hold a tenet of "Focus on trust, quality the first", moreover, we assume to produce a wonderful foreseeable future with every customer.
18-Layer Rigid-Flex PCB, With the superior and exceptional service, we've been well developed along with our customers. Expertise and know-how ensure that we are always enjoying the trust from our customers in our business activities. "Quality", "honesty" and "service" is our principle. Our loyalty and commitments remain respectfully at your service. Contact Us Today For further information, contact us now.

Hot Products

  • XCVU9P-2FLGB2104I

    XCVU9P-2FLGB2104I

    assurance, complete models. If you don't find what you are looking for, you can get more valuable information via email, such as XCVU9P-2FLGB2104I stock quantities, offers
  • XC6VLX75T-2FFG484I

    XC6VLX75T-2FFG484I

    XC6VLX75T-2FFG484I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include rich logical units and I/O resources
  • XCZU15EG-1FFVC900I

    XCZU15EG-1FFVC900I

    XCZU15EG-1FFVC900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4S100G5F45I1N

    EP4S100G5F45I1N

    EP4S100G5F45I1N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-2FFG676I

    XC7Z045-2FFG676I

    ​XC7Z045-2FFG676I is a high-performance SoC (System on Chip) FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Zynq-7000 series
  • XC7VX690T-2FFG1158C

    XC7VX690T-2FFG1158C

    XC7VX690T-2FFG1158C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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