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    XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.
  • XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-3210PQI

    HI-3210PQI

    HI-3210PQI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT41K128M16JT-125AAT:K

    MT41K128M16JT-125AAT:K

    ​MT41K128M16JT-125AAT:K is a type of dynamic random-access memory (DRAM) module commonly used in computer systems. It has a capacity of 2 GB and a data transfer rate of 1600 megatransfers per second (MT/s).
  • XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.
  • 28OZ Heavy copper PCB

    28OZ Heavy copper PCB

    28OZ Heavy copper PCB Ultra-thick copper multilayer printed boards are generally special types of printed circuit boards. The main features of such printed circuit boards are 4-12 layers, the inner layer copper thickness is greater than 10OZ, and the quality is high. The following is about 28OZ Heavy Copper Board related, I hope to help you better understand 28OZ Heavy Copper Board.
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  • Multilayer PCB laminated structure

    Before designing multi-layer PCB, the designer needs to first determine the circuit board structure according to the scale of the circuit

  • Dongbao Circuit Board Industrial Park to build a park with an annual output value of 10 billion yuan

    According to the relevant person in charge of the management committee of Dongbao Industrial Park, the park has officially entered 6 companies, including Meidian, Weide, and Jiuxiang have been put into production, Jinrun Dingsheng is debugging equipment, Hongxin Huayin, Yongchuangxin are under construction Plant.

  • Multilayer PCB Laminate Structure

    Before designing a multi-layer PCB circuit board, the designer needs to first determine the circuit board structure used according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC)

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • Detailed explanation of Multilayer PCB laminated structure

    Before designing multi-layer PCB circuit board, the designer needs to first determine the circuit board structure according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC),

  • How to maintain PCB in PCB Factory

    Although PCB board has a certain self-protection function, it should be avoided from being in a corrosive environment in daily use, and the corrosive factors should be eliminated as much as possible so as to greatly extend its service life. When using, try to keep it in a medium temperature environment to avoid high temperature and low temperature environment. So how does the PCB Factory maintain the PCB?

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