Inlaid copper Coin PCB Manufacturers

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Hot Products

  • XCZU15EG-1FFVB1156I

    XCZU15EG-1FFVB1156I

    ​XCZU15EG-1FFVB1156I Zynq™ UltraScale+ ™ MPSoC devices not only provide scalability for 64 bit processors, but also combine real-time control with software and hardware engines, supporting graphics, video, waveform, and packet processing
  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.
  • 8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB is pressed 3-6 layers first, then 2 and 7 layers are added, and finally 1 to 8 layers are added, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • EP3C25U256C7N

    EP3C25U256C7N

    ​EP3C25U256C7N is an FPGA (Field Programmable Gate Array) launched by Intel. This FPGA belongs to the Cyclone III series and has the following key features and specifications
  • LT8390IUFD#PBF

    LT8390IUFD#PBF

    LT8390IUFD#PBF also provides input or output current monitoring and power good indication, supporting the adjustment of output voltage and input or output current within the input voltage range of 4V to 60V.
  • XC7Z020-1CLG400C

    XC7Z020-1CLG400C

    ​XC7Z020-1CLG400C is a powerful FPGA (Field Programmable Gate Array) chip with 20000 logic units that can be used to design various complex hardware systems. This chip has abundant storage resources, high-speed I/O interfaces, and embedded processors, which can meet various application needs.

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