22Layer RF PCB a radiofrequenza HONTEC lavora a stretto contatto con il team di progettazione del prodotto per garantire che gli obiettivi di costo/prestazioni del progetto siano raggiunti fornendo informazioni sulle opzioni dei materiali, sui costi relativi e sui problemi DFM. Nella foto, 22L RF - Materiale per radiofrequenza; THK: 2,45 mm; finitura superficiale: ENIG; controllo dell'impedenza.
Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.
MEGTRON6 PCB is advanced material designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. The main attributes of MEGTRON6 PCB are: low dielectric constant and dielectric dissipation factors, low transmission loss and high heat resistance; Td = 410°C (770°F). MEGTRON6 PCB meets IPC specification 4101 /102 /91.
high-speed PCB design circuit boards guide for the design of high-speed circuit boards will be of great help engineers.High-Speed PCB Layout TipsApplication BriefSLOA102 - September 2002High-Speed PCB Layout TipsBruce Carter ABSTRACT High-speed op amp circuit design requires special attention.
Most of 5g products need 5g test PCB, which can be used normally after debugging. Therefore, 5g test PCB has become a popular product. Hontec specializes in producing communication PCB.
TU-943R High-speed PCB - when wiring the multi-layer printed circuit board, as there are not many lines left in the signal line layer, adding more layers will cause waste, increase certain workload and increase the cost. To solve this contradiction, we can consider wiring on the electrical (ground) layer. First of all, the power layer should be considered, followed by the formation. Because it is better to preserve the integrity of the formation.
