ENEPIG PCB is the abbreviation of gold plating, palladium plating and nickel plating. ENEPIG PCB coating is the latest technology used in electronic circuit industry and semiconductor industry. The gold coating with thickness of 10 nm and palladium coating with thickness of 50 nm can achieve good conductivity, corrosion resistance and friction resistance.
MEGTRON6 PCB is advanced material designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. The main attributes of MEGTRON6 PCB are: low dielectric constant and dielectric dissipation factors, low transmission loss and high heat resistance; Td = 410°C (770°F). MEGTRON6 PCB meets IPC specification 4101 /102 /91.
Multilayer PCB refers to a printed circuit board with more than three conductive pattern layers and insulating materials between them, and the conductive patterns are interconnected according to the requirements. Multilayer circuit board is the product of the development of electronic information technology to high speed, multi-function, large capacity, small size, thin and lightweight.
The golden finger is composed of many golden yellow conductive contacts. It is called "golden finger" because its surface is gilded and the conductive contacts are arranged like fingers. The step gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
The 8-layer gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
The main reason for using SFF on the ONU side is that the ONU products of the EPON system are usually placed on the user side and require fixed, not hot-swappable. With the rapid development of PON technology, SFF is gradually replaced by BOB.The following is about 4.25g Optical Module PCB related, I hope to help you better understand 4.25g Optical Module PCB.
