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    XC7S25-2CSGA225I

    XC7S25-2CSGA225I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066K3F40I2LG

    10AX066K3F40I2LG

    10AX066K3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU3P-2FFVB676E

    XCKU3P-2FFVB676E

    ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,
  • XC7A100T-1FGG484I

    XC7A100T-1FGG484I

    XC7A100T-1FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-370 HDI PCB

    EM-370 HDI PCB

    EM-370 HDI PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
  • XC6SLX16-3FTG256C

    XC6SLX16-3FTG256C

    XC6SLX16-3FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

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    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

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    There are many forms of matter, such as solid, liquid, gas, plasma and so on. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics and so on, insulators. Metals with good conductivity, such as gold, silver, copper, iron, tin and aluminum, are called conductors. The material between conductor and insulator can be simply called semiconductor. Compared with conductors and insulators, the discovery of semiconductor materials is the latest. Until the 1930s, when the purification technology of materials was improved, the existence of semiconductors was really recognized by the academic community.

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  • The introduction of the high speed board

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