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Our crew through skilled training. Skilled skilled knowledge, strong sense of company, to meet the company wants of customers for 18-Layers PCB,Large size coil PCB,Sensor coil PCB,High Power power supply Coil PCB,10-Layers Coil PCB, Created merchandise with brand price. We attend seriously to produce and behave with integrity, and via the favor of buyers at your house and overseas inside the xxx industry.
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  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

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    Integrated circuit is a way of miniaturization of circuits (mainly including semiconductor equipment, also including passive components, etc.). Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected, fabricated on a small or several small semiconductor chips or dielectric substrates,

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular.

  • Definition of PCB

    PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.

  • The world's top three chip manufacturers

    Under the background of chip shortage, chip is becoming a crucial field in the world. In the chip industry, Samsung and Intel have always been the world's largest IDM giants (integrating design, manufacturing and sealing and testing, basically without relying on others). For a long time, the Iron Throne of global chips was fought back and forth between the two until TSMC rose and the bipolar pattern was completely broken.

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

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