EM-370 HDI PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
EM-526 High-speed PCB, with the rapid development of electronic technology, more and more large-scale integrated circuits (LSI) are used. At the same time, the use of deep submicron technology in IC design makes the integration scale of the chip larger.
When the 40-layer M6G high speed PCB is close to the parallel high-speed differential signal line pair, in the case of impedance matching, the coupling of the two lines will bring many advantages. However, it is believed that this will increase the attenuation of the signal and affect the transmission distance.
Megtron6 high speed PCB needs not only high-speed components, but also genius and careful design. The importance of device simulation is the same as that of digital. In high speed system, noise is a basic consideration. High frequency will produce radiation and then interference.
The process of Meg6 high speed PCB design is usually: Layout - pre wiring simulation - change layout - post wiring simulation, and the wiring is not started until the simulation results meet the requirements.
Definition of Meg7 High speed PCB: it is generally believed that if the frequency of the digital logic circuit reaches 45,50MHz and the circuit working at this frequency accounts for a certain proportion of the whole system (such as 1amp 3), it will become a high speed circuit.
