Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.
PTFE multilayer PCB--Agilent equipment provides customers with products for optical networks, transmission networks, broadband and data networks, wireless communication and microwave network types of networks and systems.The following is about Agilent equipment, I hope to help you better understand Agilent equipment.
