Products
Home > Products > EPM1270T144C5N

EPM1270T144C5N Manufacturers

As for aggressive selling prices, we believe that you will be searching far and wide for anything that can beat us. We are able to state with absolute certainty that for such good quality at such costs we've been the lowest around for EPM1270T144C5N, You would not have any communication problem with us. We sincerely welcome prospects all around the globe to call us for business enterprise cooperation.
EPM1270T144C5N, With good quality, reasonable price and sincere service, we enjoy a good reputation. Items are exported to South America, Australia, Southeast Asia and so on. Warmly welcome customers at home and abroad to cooperate with us for the brilliant future.

Related Products

Hot Products

  • XA7Z020-1CLG400Q

    XA7Z020-1CLG400Q

    XA7Z020-1CLG400Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU2CG-L1SFVC784I

    XCZU2CG-L1SFVC784I

    XCZU2CG-L1SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • XC7Z020-3CLG484E

    XC7Z020-3CLG484E

    ​The XC7Z020-3CLG484E embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.
  • XC7Z045-2FFG900E

    XC7Z045-2FFG900E

    ​The XC7Z045-2FFG900E first generation architecture is a flexible platform that provides a fully programmable alternative to traditional ASIC and SoC users while launching new solutions. ARM® Cortex ™- The A9 processor comes in dual core (Zynq-7000) and single core (Zynq-7000S) Cortex-A9 configurations to choose from, providing integrated 28nm programmable logic per watt performance, with power consumption and performance levels exceeding those of discrete processors and FPGA systems
  • XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I has 43661 logic components, 2.04 Mbit embedded memory, minimum operating temperature bit -40 C, maximum operating temperature bit+100 C. Provide industry-leading connectivity features such as high logic pin ratio, small-sized packaging, MicroBlaze? Soft processors, and various supported I/O protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive information and entertainment systems, and industrial automation applications
  • Related Blog
  • Reviews

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • What are the advantages of PCB board?

    In our daily life, there are many intelligent electrical appliances that bring us many conveniences, such as floor sweeping robots, dish washing robots, cooking robots, etc. among them, these robots inevitably need PCB boards with reliable quality in the assembly process

  • Semiconductor parts have risen with the wind

    Every time through AI flash, Guojin Securities said that semiconductor equipment parts play an important role in the industrial chain, with a large number, a wide variety and obvious market fragmentation characteristics

  • Multilayer PCB laminated structure

    Before designing multi-layer PCB, the designer needs to first determine the circuit board structure according to the scale of the circuit

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

  • Do you really know about FPCs

    of FPC is becoming more and more significant in order to achieve more functions. Now Jin Baize will talk about the characteristics of FPC on the advantages and disadvantages of FPC.

Send Inquiry