ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
