R-F775 Rigid-Flex PCB Manufacturers

We goal to see good quality disfigurement within the manufacturing and provide the most effective support to domestic and overseas shoppers wholeheartedly for R-F775 Rigid-Flex PCB,10-layer Rigid - Flex PCB,Blind buried hole Rigid - Flex PCB,8-layer Rigid - Flex PCB, Accurate process devices, Advanced Injection Molding Equipment, Equipment assembly line, labs and software progress are our distinguishing feature.
R-F775 Rigid-Flex PCB, With good quality, reasonable price and sincere service, we enjoy a good reputation. Products are exported to South America, Australia, Southeast Asia and so on. Warmly welcome customers at home and abroad to cooperate with us for the brilliant future.

Hot Products

  • XCR3384XL-12FT256I

    XCR3384XL-12FT256I

    XCR3384XL-12FT256I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ADS1112IDGSR

    ADS1112IDGSR

    ADS1112IDGSR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45T-2FGG484C

    XC6SLX45T-2FGG484C

    XC6SLX45T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx's Kintex UltraScale+ family. It features 5.3 million logic cells, 113 Mb of UltraRAM and 2,722 DSP slices, and utilizes the 20nm process technology with FinFET+ technology, providing high performance and energy efficiency.
  • ADV7513BSWZ

    ADV7513BSWZ

    ADV7513BSWZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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