LED Aluminum Nitride Ceramic base board Manufacturers

Our crew through skilled training. Skilled skilled knowledge, strong sense of company, to meet the company wants of customers for LED Aluminum Nitride Ceramic base board,2-layer Alumina ceramic PCB,Cermic PCB,3-layer Aluminum nitride ceramic PCB,AIN PCB, Created merchandise with brand price. We attend seriously to produce and behave with integrity, and via the favor of buyers at your house and overseas inside the xxx industry.
LED Aluminum Nitride Ceramic base board, Our company adheres to the spirit of "lower costs, higher quality, and making more benefits for our clients". Employing talents from the same line and adhering to the principle of "honesty, good faith, real thing and sincerity", our company hopes to gain common development with clients from both at home and abroad!

Hot Products

  • XC7S25-2CSGA225I

    XC7S25-2CSGA225I

    XC7S25-2CSGA225I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066K3F40I2LG

    10AX066K3F40I2LG

    10AX066K3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU3P-2FFVB676E

    XCKU3P-2FFVB676E

    ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,
  • XC7A100T-1FGG484I

    XC7A100T-1FGG484I

    XC7A100T-1FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-370 HDI PCB

    EM-370 HDI PCB

    EM-370 HDI PCB--From the perspective of major manufacturers, the existing capacity of domestic major manufacturers is less than 2% of the global total demand. Although some manufacturers have invested in expanding production, the capacity growth of domestic HDI still can not meet the demand of rapid growth.
  • XC6SLX16-3FTG256C

    XC6SLX16-3FTG256C

    XC6SLX16-3FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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