ENEPIG PCB is the abbreviation of gold plating, palladium plating and nickel plating. ENEPIG PCB coating is the latest technology used in electronic circuit industry and semiconductor industry. The gold coating with thickness of 10 nm and palladium coating with thickness of 50 nm can achieve good conductivity, corrosion resistance and friction resistance.
HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.The following is about 10 layers of HDI PCB, I hope to help you better understand 10 layers of HDI PCB.
